REMOVAL RESIST RR-10B/13

 

OUTLINES:

REMOVAL RESIST RR-10B/13 consists of Vinyl-based resin principally, and designed as thermosetting-type removable solder resist ink.

RR-10B/13 is applied by screen-printing, and the coated-film is able to be peeled, such as with fingers easily after soldering process. No residue remained and no need of post-treatment, such as rinsing on coated area that after RR-10B/13 was removed.

 

APPLICATION FIELDS:

Single-sided PCB and Double-sided Cu-thru-hole PCB.

 

CHARACTERISTICS:

ITEM

TYPICAL VALUE

MEASUREMENTS

Color : State

Blue (white, red) –colored paste

         ---

Solid Content

100.0wt%

dried in an oven in 130 x 1hr.

Specific Gravity (at 25)

1.16

Specific Gravity Cup Method

Viscosity( at 25)

1000 ps

Viscotester-VT-04 model

Thixotropic Index

6.0

Brookfield-HBT model

Curing Condition

130 x 10 min.

In an oven

Shelf (Pot) –Life

about 2 months

in normal tempt. (25)

Surface Hardness

2 H

JIS D 0202

Adhesion

100/100

JIS D 0202

Solder/Heat Resistance (260)

5 sec.; pass

rosin-based flux applied

Insulation Resistance Test

2.0 x 1011Ω

JIS Z 3197

Corrosion Test

pass

JIS Z 3197; on copper

Solvent Resistance

pass

Freon or Alcohol-based solvent

 

DIRECTION FOR USE:

1.  Stirring RR-10B/13 up completely before application.

2. Use as supplied without dilution.

3. A 80-100 meshes polyester screen with emulsion thickness of 200μm  would be recommend for coating purposes.

4. Make the thickness of the coated film at least 150μm  and up. The thick of the coated-film thickness, the better heat

    resistance can be obtained especially, when in hot-air levelling or reflow soldering, coated-film.

5. The recommended curing condition is 130-140 x 10min. or up in an oven.

6. Use Ester-group or Halide-Carbon-group solvents to wash/rinse the related tools after application.

7. Store RR-10B/13 in a certain area with low temperature below 25, and avoid direct sunshine.

  High temperature, e.g. over 40, will make 44-10B/13 gel abruptly.

 

REFERENCE DATA:

HEAT RESISTANCE; SOLVENT RESISTANCE

Printing Conditions: 80 meshes Polyester screen applied;

                 Emulsion Thickness: 200μm  ;

                 Coated-Film thickness: 150μm .

 

ROSIN-BASED FLUX

WATER-SOLUBLE FLUX

SOLDERING-TIME

5 SEC.

10 SEC.

15 SEC.

20 SEC.

7 SEC.

14 SEC.

ON COPPER-FOLL

○∼△

△∼

○∼△

ON THRU-HOLE

○∼△

A mixture-solder with 250 applied;

   Evaluation:  ---pass;  ---slihgt-melted;   ---melted and come-off

 

 

1.1.1.-TRICHLOROETHANE

I.P.A.

DIPPING-TIME

5 MIN.

10 MIN.

15 MIN.

10 MIN.

20 MIN.

30 MIN.

APPEARANCE CHANGE

no change

no change

no change

Whitish-flux-residues-retained; film-no change

REMOVALABILITY

A rosin-based flux applied;

   Dipped into above-mentioned solvents at normal tempt. After soldering;

   Soldering conditions: 250 x 5 sec.

   Evaluation:  ---pass;   ---Film-Expanded;   ---Inpeelable